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Item
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Flex PCB
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Rigid-Flex PCB
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|
Material
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PI,PET,PEN
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PI+FR4
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|
Layers
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1-6
|
2-12
|
|
Base Copper Thickness
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1/4 -2OZ
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1/4-2OZ for flex, 1/4-4OZ for rigid
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|
Board Thickness(Min)
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Single Sided
|
0.05mm
|
|
|
Double Sided
|
0.10mm
|
0.20mm
|
|
Board Dimension(Max)
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500mm x 800mm
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|
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Width/Space(Min)
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Copper weight upto 0.5OZ
|
0.06mm
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|
Copper weight upto 0.5-1OZ
|
0.075mm
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Copper weight over 1OZ
|
0.10mm
|
|
Via Type
|
Through hole, Blind, Buried
|
|
Silkscreen Width/Space(Min)
|
0.10mm
|
|
Solder Mask Bridge(Min)
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0.20mm for coverly, 0.12mm for LPI
|
|
Hole(Min)
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Drill
|
0.15mm
|
|
Punching
|
0.5mm
|
|
Slot(Min)
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0.5mm(punching), 0.8mm(Routing)
|
|
Dimension Tolerance
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Line Width
|
0.03mm(W<=0.3mm, 10%(W>0.3mm)
|
|
Hole
|
+0.05mm(NPTH)
|
|
+0.05mm(PTH)
|
|
Outline
|
+0.10mm, Special +0.05mm with high precise hard tool
|
|
Conductor to Outline
|
+0.10mm, Special +0.05mm with high precise hard tool
|
|
Surface Treatment
|
Electroless Nickel Immersion Gold (ENIG)
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Ni: 2-6um(80-240um”) Au:0.05-0.10um(2-4u”)
|
|
Ni/Au Platting
|
Ni: 2-8um(80-320u”) Au:0.05-2um(2-80u”)
|
|
Tin Platting
|
5-20um
|
|
Immersion Silver
|
0.1-0.4um
|
|
Immersion Tin
|
0.5-1.5um
|
|
OSP
|
0.2um min
|
|
Hard gold
|
Hardness over 150 HV
|