| 1 |
Layers |
2-30 |
| 2 |
Board type |
FR-4, Metal base plate, High frequency materials |
| 3 |
Max. PCB board dimension |
500mm X 600mm |
| 4 |
PCB dimension tolerance |
±0.1mm |
| 5 |
Finish thickness |
0.20mm - 3.2mm |
| 6 |
Finish thickness tolerance |
±10% |
| 7 |
Medium thickness |
0.075mm - 5.000mm |
| 8 |
Min. conductor width |
0.1mm |
| 9 |
Min. conductor spacing |
0.1mm |
| 10 |
Outer copper thickness |
35um - 175um |
| 11 |
Inner copper thickness |
17um - 175um |
| 12 |
Drilling aperture (Mechanical drill) |
0.20mm - 6.35mm |
| 13 |
Hole position tolerance (Mechanical drill) |
0.076mm |
| 14 |
Into holes (Mechanical drill) |
0.15mm - 6.30mm |
| 15 |
Aperture tolerance (Mechanical drill) |
0.076mm |
| 16 |
Thickness aperture |
10:1 |
| 17 |
Solder Mask Type |
Photosensitive ink ,Curing ink , Inferior smooth printing ink
|
| 18 |
Min. Solder Mask bridge |
0.1mm |
| 19 |
Min. Solder Mask spacing |
0.1mm |
| 20 |
Impedance tolerance |
±10% |
| 21 |
Surface treatment |
HAL, ENIG, Immersion Silver/TIN, OSP etc. |
| 22 |
Countersink hole |
Min.depth(D)6mil;The Depth of tolerance ±6mil |