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PCB Capabilities

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Ronak Circuits Pvt. Ltd. has global level manufacturing unit with an Experts, PCBs are heart of any electronic hardware which should be high quality product.

Capacity For Rigid Board

Item Standard Advance
Layer Counts 1–12 Layers 12–50 Layers
Final Board Thickness 0.4 ~ 2.4 mm 0.2~6.0mm
Max. Panel Size 530mm*470mm 670mm*540mm
Available Laminate Material CEM-1, FR-4 (High Tg, High CTI, Halogen Free, High Frequency), PET, Ceramic Base, Metal Base. Metal based (thickness range: 20oz/copper layer)
Surface Finish LF-HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold 100% on
Impedance Control 30% 10% min
Min. Line Width/Space 4/4 mil 2.5mil
Copper Thickness Standard: 18um, 35um, 70um,105um 14-layer thickness range: 280um/copper layer
Min. finished hole size 0.2mm 0.1mm

Capacity For FPC & Rigid Flex PCB

Item Flex PCB Rigid-Flex PCB
Material PI,PET,PEN PI+FR4
Layers 1-6 2-12
Base Copper Thickness 1/4 -2OZ 1/4-2OZ for flex, 1/4-4OZ for rigid
Board Thickness(Min) Single Sided 0.05mm 0.20mm
Double Sided 0.10mm
Board Dimension(Max) 500mm x 800mm
Width/Space(Min) Copper weight upto 0.5OZ 0.06mm
Copper weight upto 0.5-1OZ 0.075mm
Copper weight over 1OZ 0.10mm
Via Type Through hole, Blind, Buried
Silkscreen Width/Space(Min) 0.10mm
Solder Mask Bridge(Min) 0.20mm for coverly, 0.12mm for LPI
Hole(Min) Drill 0.15mm
Punching 0.5mm
Slot(Min) 0.5mm(punching), 0.8mm(Routing)
Dimension Tolerance Line Width 0.03mm(W<0.3mm), 10%(W>0.3mm)
Hole +0.05mm(NPTH)
+0.05mm(PTH)
Outline +0.10mm, Special +0.05mm with high precise hard tool
Conductor to Outline +0.10mm, Special +0.05mm with high precise hard tool
Surface Treatment Electroless Nickel Immersion Gold (ENIG) Ni: 2-6um(80-240um") Au:0.05-0.10um(2-4u")
Ni/Au Platting Ni: 2-8um(80-320u") Au:0.05-2um(2-80u")
Tin Platting 5-20um
Immersion Silver 0.1-0.4um
Immersion Tin 0.5-1.5um
OSP 0.2um min
Hard gold Hardness over 150 HV