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PCB Capabilities

Capabilities Icon

We can manufacture printed circuit boards on virtually any substrate. any size, and any shape. Technology types include, but are not limited to RF/Microwave printed circuit boards, rigid printed circuit boards, metal clad boards, flex, and rigid-flex circuits.

Everyday Volume Capability

  • Layers (1–34)
  • Lines And Spaces 3mil Line / 3mil Space
  • Panel Thickness <= 350 Mils
  • Controlled Impedance +/- 5%
  • All Types Of Final Finish Available
  • Blind And Buried Vias
  • Heat Sink Technology
  • High Performance And Emerging Technology Materials
  • Sequential Lamination
  • Conductive And Non-Conductive Via Fill
  • BGA
  • Ultra Fine Pitch

Basic Flex Capability

  • Single-Sided Flex
  • Double-Sided Flex
  • Dual Access
  • Stiffeners Of Polyimide Or FR-4
  • Multilayer Flex
  • Rigid Flex – Multilayer Up To 16 Layers

CAM

  • Pre-CAM DRC Analysis
  • CAM-Controlled Penalization With DFM
  • Extracted Net-List Comparison

Laminate Type

  • Lead Free Alternative High Tg Laminates (Isola, Ventec, Rogers etc.)
  • All Teflon (Rogers, Taconic, Nelco)
  • Standard FR4, FR406, FR408, BT, Cyanate Esters
  • Polyimides
  • GETEK/Megtron/Nelco-13
  • Ceramic Of Various Types
  • IMS Materials: Aismalibar, Bergquist, C-Sem, Ventec

Copper Cladding

  • Innerlayer Maximum Cu Weight: 6oz
  • Outerlayer Maximum Cu Weight: 8oz
  • Minimum Cu Weight: 1/4 Oz

Multilayer Constructions

  • Minimum Core Thickness: .002"
  • Maximum Layer Count: 34
  • Minimum Multilayer Thickness: .025"
  • Maximum Multilayer Thickness (Non-HASL): .350"
  • Maximum Multilayer Thickness (HASL Or LF HASL): .170"
  • Blind/Buried Vias – Sequential Lamination
  • Design And Verification Of Impedance Control

Etching

Minimum Conductor Width:

Start Cu Foil weight Internal External
0.5 oz. .003" .004"
1.0 oz. .004" .005"
2.0 oz. .005" .006"
3.0+ oz. .006" .007"

Minimum Feature Spacing:

Start Cu foil weight Internal External
0.5 oz. .003" .004"
1.0 oz. .005" .006"
2.0 oz. .006" .0075"
3.0+ oz. .007" .009"

Drilling & Plating

  • Max. Aspect Ratio: 14 To 1
  • Min. Hole Size Tolerance (Plated): +.003" Min Hole Size Tolerance (Unplated): +.0015"
  • Min. Drilled Hole Size: 6 Mil; Maximum Hole Size: 250 Mil
  • Min. Annular Plane Clearance Of Drilled Hole: .010"
  • Min. Internal Pad Size To Drill Hole Size: +.012"
  • Min. External Pad Size To Drill Hole Size: +.010"
  • Min. Plane Clearance To Drill Hole: .020"

Soldermask

  • Spray-Coated Photo-Imageable Solder Mask
  • Screened Epoxy Solder Mask
  • Screened UV-Curable Via Plugging
  • Peelable Mask With Stencil
  • Min. Web Thickness: .004
  • Min. Solder Mask Clearance: .0025

Via Fill / Via in Pad

  • Conductive
  • Non-Conductive

Final Finish

  • HASL - Hot Air Solder Level
  • Lead Free Hot Air Level
  • ENIG - Electroless Nickel / Immersion Gold
  • Electroless Palladium
  • Electrolytic Hard Gold Over Electrolytic Nickel
  • Electrolytic Soft Gold And Electrolytic Nickel
  • Immersion Tin / Immersion Silver / OSP
  • Carbon Ink - Switch Pads

Fabrication

  • Scoring - CNC (Jump Scoring Available); Web Routing Available
  • Edge Milling / Edge Beveling
  • Hard-Tool Pierce And /Or Blank
  • Minimum Slot Width: .020"
  • Min. Inside Radius (Milled): .015"
  • Min. Drilled Hole Size: .008"
  • Min. Dist. Of Plated Hole To Internal Trace/Plane: .0075"
  • Standard Finished Minimum Annular Ring Is .001" (If Not Specified)

Electrical Test

  • Dual Access Testing - Universal Grid
  • Net list Testing (Gerber - Extracted / IPC- D-356)
  • Fixtureless Testing For Proto/Small Volume
  • Impedance Testing (Polar CITS-500) Impedance Tolerance: +/- 5%
  • Min. Continuity Test: 10 Ohm
  • Max Isolation Test: 10 M Ohm
  • Voltage: 20 - 1000 VDC
  • Fine Pitch Testing: Min. SMD Pitch: .012", Min. BGA Pitch: 1 mm (.0394)

Aluminum/Brass/Copper Heat Sink Circuits

  • RF Telecommunication (500 MHz To 100 GHz); Complex Board Shapes fabricated using CNC routing, milling
  • Aluminum-Backed PTFE Circuit With Nickel And Gold Plating On Both Copper Circuitry And Aluminum
  • Single And Double-Sided Circuits With Thermally Conducting Bonding Film
  • Applications: Power Supplies, Automotive Electronics, LEDs, Computers, Motor Controls